Proceedings of 2004 International IEEE Conference on the Asian Green Electronics: Agec

January 5-6, 2004, City University of Hong Kong, Hong Kong, Ch
  • 253 Pages
  • 0.13 MB
  • 8896 Downloads
  • English
by
Institute of Electrical & Electronics Enginee
Electronics - General, Technology & Industrial
The Physical Object
FormatHardcover
ID Numbers
Open LibraryOL11000464M
ISBN 10078038203X
ISBN 139780780382039

Proceedings of International IEEE Conference on the Asian Green Electronics: (AGEC): January, City University of Hong Kong, Hong Kong, China [and] January, Mission Hills Resort, Shenzhen, China. Get this from a library. Proceedings of International IEEE Conference on the Asian Green Electronics (AGEC), JanuaryCity University of Hong Kong, China, January, Mission Hills Resort, Shenzhen, China.

[Components, Packaging, and Manufacturing Technology Society;]. Get this from a library. Asian Green Electronics, AGEC. Proceedings of International IEEE Conference on the.

[Institute of Electrical and Electronics Engineers;]. Published in: International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of. Article #: Date of Conference: Jan. Date Added to IEEE Xplore: 27 September ISBN Information: Print ISBN: X INSPEC Cited by: Get this from a library.

Asian Green Electronics (AGEC), IEEE International Conference on. International IEEE Conference on the Asian Green Electronics (AGEC).

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Environmental management in semiconductor and printed circuit board industry in India. Part I: Survey results and case studies International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.

Article #: Date of Conference: Jan. Date Added to IEEE Xplore: 27 September Proceedings of International Conference on Asian Green Electronics, AGEC.

Location: Shanghai, China; International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Location: Hong Kong, China & Shenzhen, China.

Description Proceedings of 2004 International IEEE Conference on the Asian Green Electronics: Agec PDF

TOP BOOKS Proceedings of International IEEE Conference on the Asian Green Electronics: Agec: January, City University of Hong Kong, Hong Kong, China [And] January, Mission Hills Resort, Shenzhen, China Mile Markers: The Most Important Reasons Why Women Run Iron Line Diagnostics in X-ray Sources: Proceedings of a Workshop Held in Varenna.

Proceedings of International IEEE Conference on the Asian Green Electronics (AGEC),p. Summary Of fundamental importance to enhance the reliability of flip chip on board (FCOB) packages is to avoid the initiation and propagation of various interfacial failures, and therefore, robust interfacial bonds between the underfill and other components are highly desired.

Proceedings of the International IEEE Conference on Asian Green Electronics (AGEC), Jan.Shenzhen, China Subject CategoriesCited by: (English) In: Proceedings of International IEEE Conference on the Asian Green Electronics (AGEC),p.

Conference paper, Published paper (Refereed) Abstract [en] Flip Chip connections enormously reduces the amount of solder as compared to mounting packaged devices, apart from also offering superior high frequency properties and placement density.

Asian Green Electronics,AGEC, proceedings of International Conference on. International Conference on Asian Green Electronics Design for manufacturability and reliability AGEC: Responsibility: organized by IEEE [and others] ; sponsored by.

: A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps, in Proceedings of International IEEE Conference on Asian Green Electronics (AGEC) IEEE, Piscataway, NJ – Cited by: IEEE Conferences Committee formulates and recommends actions, strategies, and policies for IEEE conferences.

It provides oversight for conference-related activities, has jurisdiction over all 1,+ IEEE global conferences, and ensures compliance per all IEEE Policies - Section 10 (PDF, 1 MB).

The committee is administratively a standing committee of TAB with members from IEEE Technical. (English) In: Proceedings of International IEEE Conference on the Asian Green Electronics (AGEC), Piscataway, NJ, USA: IEEE,p.

Conference paper, Published paper (Other academic) Abstract [en] Flip Chip connections enormously reduces the amount of solder as compared to mounting packaged devices, apart from also offering superior high frequency properties. (English) In: Green Electron.,p. Conference paper, Published paper (Refereed) Abstract [en] This paper addressed the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices.

Keynote Speech Mr Hamed El-abd. Conference: Asian Green Electronics, AGEC. Proceedings of International Conference on. Cite this publication. El-abd. Abstract. Quality challenges of reused components.

Conference: Asian Green Electronics, AGEC. Proceedings of International IEEE Conference on the. IEEE sponsors more than 1, annual conferences and events worldwide, curating cutting-edge content for all of the technical fields of interest within IEEE.

Use the IEEE conference search to find the right conference for you to share and discuss innovation and interact with your community. New interconnection materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems.

In particular, anisotropic conductive adhesives (ACAs) have gained popularity as a potential replacement for solder interconnects. Despite numerous benefits, ACA-type packages pose several reliability problems. Integrating environmental product design into HP inkjet printing supplies. Asian Green Electronics, AGEC.

Proceedings of International IEEE Conference on the. Conference: Asian Green Electronics, AGEC. Proceedings of International Conference on. Standby power consumption of electric devices is a major issue. It accounts for 5 % to 14 % of the total residential power consumption.

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However, applying state-of-the-art power management techniques can reduce this waste of energy drastically. In this paper we present an innovative and secure Near Field Communication (NFC) Interface technique for everyday electronic by: 2.

This paper proposes a system called SPRS (Standby Power Reduction System), which tries to reduce the power consumption by physically turning off appliances in standby mode. Mcgarry, L. "Standby power challenge", Asian Green Electronics, AGEC. Proceedings of International IEEE Conference, pp.

Google Scholar; J. Heo, CS. DOI: /HICSS Corpus ID: Organizational and technological infrastructures alignment @article{CroteauOrganizationalAT, title={Organizational and technological infrastructures alignment}, author={Anne-Marie Croteau and Simona Solomon and Louis Raymond and François Bergeron}, journal={Proceedings of the 34th Annual Hawaii International Conference on.

J. Villain, W. Jillck, E. Schmitt, and T. Qasim, Properties and reliability of SnZn-based lead-free solder alloys, in Proceedings of the International IEEE Conference on the Asian Green Electronics, AGEC (IEEE Cat. 04EX), pp. 38–41 (). Google ScholarCited by: 1.

The search sources that were used are: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Inspec, Electronic Components and Technology Conference series proceedings, Journal.

Companies are pursuing green manufacturing work to efficiently reduce or eliminate pollutants and hazardous substances as a result of their operations. Green manufacturing is an economically viable alternative that provides a competitive advantage as well as creates sustainable development, allows opportunity for re-investment, supports cost-saving strategies, and has a positive impact on the.

The effects of conductive particles on the electrical stability and reliability of anisotropic conductive film (ACF) joints for chip-on-board applications were investigated. In this paper, two types of conductive particles were prepared. One was a conventional Ni/Au-coated polymer ball, and the other was a Ni/Au-coated polymer ball with Ni/Au-projections.Made available through IEEE Xplore under title: Asian Green Electronics,AGEC, proceedings of International Conference on.

Related Work Asian Green Electronics,AGEC, proceedings of International Conference on.Foreword to the special section of the Asian Green Electronics Conference (AGEC) Liu, J., Griese, SPIE, Vol.

p.

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(Proceedings of SPIE - The International Society for Optical Engineering). Research output: ChaptersIEEE International Symposium on Applications of Ferroelectrics. IEEE, Vol. 2. p. Research output.